Light-emitting device including cover and fixing member

ABSTRACT

A light-emitting device includes: a substrate; a light-emitting element disposed on the substrate; a light-transmissive member disposed on a light extraction surface of the light-emitting element; a cover that covers the light-emitting element with a gap between the cover and the light-emitting element, the cover including: an upper portion that is transmissive to light emitted from the light-emitting element, a sidewall extending along a peripheral edge of the upper portion and having an outer lateral surface, and a recess defined by the upper portion and the sidewall; and a fixing member arranged on at least a part of the outer lateral surface of the sidewall of the cover. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. § 119 toJapanese Patent Application No. 2019-170635, filed Sep. 19, 2019, thedisclosure of which is herein incorporated by reference in its entirety.

BACKGROUND

The present disclosure relates to a light-emitting device, anillumination device, and methods for manufacturing them.

Japanese Patent Publication No. 2010-103404 discloses an illuminationdevice including an LED element, a package with lead electrodes on whichthe LED element is mounted, a cover member attached to the package andhaving a light-transmissive part. Japanese Patent Publication No.2010-040801 discloses a light-emitting device including: an LED lampincluding an LED element mounted on a circuit board and sealed by aresin; and a cover having a light focusing means that focuses lightemitted from the LED element.

SUMMARY

There is room for improvement in reducing a thickness of theabove-described devices.

An object of certain embodiments described in the present disclosure isto provide a light-emitting device and an illumination device that canbe reduced in thickness, and to provide methods for manufacturing them.

A light-emitting device according to an embodiment of the disclosureincludes: a substrate; a light-emitting element disposed on thesubstrate; a light-transmissive member disposed on a light extractionsurface of the light-emitting element; a cover that covers thelight-emitting element with a gap therebetween, the cover including anupper portion, a sidewall extending along a peripheral edge of the upperportion, and a recess defined by the upper portion and the sidewall, theupper portion being transmissive to light emitted from thelight-emitting element, the sidewall having an outer lateral surface;and a fixing member arranged on at least a part of the outer lateralsurface of the sidewall of the cover. The fixing member is formed of amaterial that is deformable due to a pressing force generated in theevent of an engagement with a counterpart member.

An illumination device according to an embodiment of the disclosureincludes: the above-described light-emitting device; and a casing havinga through-hole, the casing being the counterpart member. Thelight-emitting device is fixed to the casing by the fixing member of thelight-emitting device being in contact with an inner surface of thethrough-hole of the casing in a state of being deformed.

A method for manufacturing a light-emitting device according to anembodiment of the disclosure includes: forming a cover by sandwiching afixing member by a molding device and injecting a light-transmissivematerial into a space defined in the molding device and by hardening orcuring the injected light-transmissive material, the cover including anupper portion, a sidewall extending along a peripheral edge of the upperportion, and a recess defined by the upper portion and the sidewall, thecover being integrated with the fixing member such that the fixingmember projects from a part of an outer lateral surface of the sidewall;disposing a light-transmissive member on a light extraction surface of alight-emitting element to be disposed on a substrate; and disposing thecover so that the light-emitting element is housed in the recess. Thefixing member is formed of a material that is deformable due to apressing force generated in the event of an engagement with acounterpart member.

A method for manufacturing a light-emitting device according to anembodiment of the disclosure includes: forming a cover by injecting alight-transmissive material into a space defined in a molding device andhardening or curing the injected light-transmissive material, the coverincluding an upper portion, a sidewall extending along a peripheral edgeof the upper portion, and a recess defined by the upper portion and thesidewall; disposing a fixing member an outer lateral surface of thesidewall such that the fixing member projects from a part of the outerlateral surface of the sidewall; disposing a light-transmissive memberon a light extraction surface of a light-emitting element to be disposedon a substrate; and disposing the cover so that the light-emittingelement is housed in the recess. The fixing member is made of a materialthat is deformable due to a pressing force generated in the event of anengagement with a counterpart member.

A method for manufacturing a light-emitting device according to anembodiment of the disclosure includes: forming a cover by injecting alight-transmissive material into a space defined in a molding device andhardening or curing the injected light-transmissive material, the coverincluding an upper portion, a sidewall extending along a peripheral edgeof the upper portion, and a recess defined by the upper portion and thesidewall; disposing a fixing member that covers an outer lateral surfaceof the sidewall; disposing a light-transmissive member on a lightextraction surface of a light-emitting element to be disposed on asubstrate; and disposing the cover so that the light-emitting element ishoused in the recess. The fixing member is formed of a soft materialthat is deformable due to a pressing force generated in the event of anengagement with a counterpart member.

A method for manufacturing an illumination device according to anembodiment of the present disclosure includes: manufacturing alight-emitting device using one of the above-described methods formanufacturing a light emitting device; and fixing the light-emittingdevice to a casing having a through-hole and constituting thecounterpart member so that the fixing member of the light-emittingdevice comes into contact with an inner surface of the through-hole ofthe casing in a state of being deformed.

A light-emitting device and an illumination device according to thepresent disclosure can be reduced in thickness thereof.

A method for manufacturing a light-emitting device according to thepresent disclosure and a method for manufacturing an illumination deviceaccording to the present disclosure allow for reducing the thicknessesof the light-emitting device and illumination device to be manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of embodiments of the invention and many ofthe attendant advantages thereof will be readily obtained by referenceto the following detailed description when considered in connection withthe accompanying drawings.

FIG. 1A is a perspective view schematically illustrating the structureof the light-emitting device according to a first embodiment.

FIG. 1B is a plan view schematically illustrating the structure of thelight-emitting device according to the first embodiment.

FIG. 1C is a schematic cross-sectional view taken along line IC-IC inFIG. 1B.

FIG. 1D is a plan view of an upper portion of a cover of thelight-emitting device according to the first embodiment, as seen from aside of the cover facing a light-emitting element of the light-emittingdevice.

FIG. 1E is a partially enlarged view of FIG. 1C.

FIG. 2 shows a flowchart of a method for manufacturing thelight-emitting device according to the first embodiment.

FIG. 3A is a cross-sectional view illustrating a step of fabricating acover and a fixing member in the method for manufacturing thelight-emitting device according to the first embodiment.

FIG. 3B is a cross-sectional view illustrating a step of forming ahard-coat layer in the method for manufacturing the light-emittingdevice according to the first embodiment.

FIG. 3C is a cross-sectional view illustrating a step of disposing alight-emitting element on a substrate in the method for manufacturingthe light-emitting device according to the first embodiment.

FIG. 3D is a cross-sectional view illustrating a step of forming alight-reflective member in the method for manufacturing thelight-emitting device according to the first embodiment.

FIG. 3E is a cross-sectional view illustrating a step of disposing thecover in the method for manufacturing the light-emitting deviceaccording to the first embodiment.

FIG. 4 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the firstembodiment.

FIG. 5 shows a flowchart of a method for manufacturing the illuminationdevice according to the first embodiment.

FIG. 6A is a plan view schematically illustrating the configuration of alight-emitting device according to a second embodiment.

FIG. 6B is a cross-sectional view taken along line VIB-VIB in FIG. 6A.

FIG. 7 shows a flowchart of a method for manufacturing thelight-emitting device according to the second embodiment.

FIG. 8A is a cross-sectional view illustrating a step of fabricating acover in the method for manufacturing the light-emitting deviceaccording to the second embodiment.

FIG. 8B is a cross-sectional view illustrating a step of forming afixing member in the method for manufacturing the light-emitting deviceaccording to the second embodiment.

FIG. 9 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the secondembodiment.

FIG. 10A is a plan view schematically illustrating the configuration ofa light-emitting device according to a third embodiment.

FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A.

FIG. 11A is a cross-sectional view illustrating a step of fabricating acover in the method for manufacturing the light-emitting deviceaccording to the third embodiment.

FIG. 11B is a cross-sectional view illustrating a step of disposing afixing member in the method for manufacturing the light-emitting deviceaccording to the third embodiment.

FIG. 12 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the thirdembodiment.

FIG. 13A is a plan view schematically illustrating the configuration ofa light-emitting device according to a fourth embodiment.

FIG. 13B is a cross-sectional view taken along line XIIIB-XIIIB in FIG.13A.

FIG. 14 is a cross-sectional view illustrating a step of forming afixing member in the method for manufacturing the light-emitting deviceaccording to the fourth embodiment.

FIG. 15 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the fourthembodiment.

FIG. 16 is a cross-sectional view schematically illustrating theconfiguration of a light-emitting device according to anotherembodiment.

DETAILED DESCRIPTION

Hereinafter, a description will be given of light-emitting devices andillumination devices and manufacturing methods thereof according toembodiments of the present disclosure. It should be appreciated,however, that the embodiments described below are illustrations oflight-emitting devices and illumination devices and methods forproducing them to give a concrete form to technical ideas of thedisclosure, and the present invention is not limited to the embodimentsdescribed below. Unless otherwise specified, the dimensions, materials,shapes, relative positions, and the like of the constituent componentsdescribed in the embodiments below are not intended to limit the scopeof the invention thereto, and are merely illustrative. Furthermore, thesizes, positional relations, and so forth of the constituent membersshown in the drawings may be exaggerated for the sake of clarity. In thefollowing description, members that are the same or analogous are giventhe same name or reference sign, and duplicative detailed descriptionsare appropriately omitted.

First Embodiment

Light-Emitting Device

FIG. 1A is a perspective view schematically illustrating the structureof the light-emitting device according to a first embodiment. FIG. 1B isa plan view schematically illustrating the structure of thelight-emitting device according to the first embodiment. FIG. 1C is aschematic cross-sectional view taken along line IC-IC in FIG. 1B. FIG.1D is a plan view of an upper portion of a cover of the light-emittingdevice according to the first embodiment, as seen from a side of thecover facing a light-emitting element of the light-emitting device. FIG.1E is a partially enlarged view of FIG. 1C.

The light-emitting device 100 according to the first embodimentincludes: a substrate 10; a light-emitting element 20 disposed on thesubstrate 10; a light-transmissive member 30 disposed on a lightextraction surface of the light-emitting element 20; a cover 50 thatcovers the light-emitting element 20 with a gap between the cover andthe light-emitting element; and a fixing member 15. The cover 50 has anupper portion 51 and a sidewall 52. The upper portion 51 transmits lightemitted from the light-emitting element 20. The side wall 52 extendsalong a peripheral edge of the upper portion 51. The fixing member 15 isprovided on at least a part of an outer lateral surface of a sidewall 52of the cover 501 lateral surface. The cover 50 has a recess 54 whosebottom is defined by the upper portion 51 and whose side is defined bythe sidewall 52. The fixing member 15 is made of a soft material that isdeformable due to a pressing force generated in the event of anengagement with a counterpart member.

The light-emitting device 100 includes, as main components: thesubstrate 10; the light-emitting element 20; the light-transmissivemember 30; a light-reflective member 40; the cover 50; the fixing member15; and further a hard-coat layer 60.

Hereinafter, configuration of the light-emitting device 100 will bedescribed.

Substrate

The substrate 10 is a member on which the light-emitting element 20 isdisposed and is preferably provided with wiring disposed on a frontsurface of and/or inside the substrate 10.

The substrate 10 is electrically connected with the light-emittingelement 20 by connecting the wiring with a pair of positive and negativeelectrodes of the light-emitting element 20 via a conductive bondingmember.

The substrate 10 is preferably formed of a material that has insulationproperties, hardly transmits light emitted from the light-emittingelement 20 and/or external light, and has a certain strength.Specifically, the substrate 10 can be formed of a ceramic such asalumina, aluminum nitride, and mullite, or formed of a resin such as aphenolic resin, epoxy resin, polyimide resin, bismaleimide triazine (BT)resin, or polyphthalamide. The substrate 10 may be a glass epoxysubstrate, a metal substrate, or a partially insulated metal substrate.

Light-Emitting Element

The light-emitting element 20 is disposed on the substrate 10. Thelight-emitting element 20 has the light extraction surface and a lowersurface opposite to the light extraction surface, preferably has thepair of positive and negative electrodes on the lower surface, and ispreferably flip-chip mounted on the substrate 10. Although thelight-emitting element 20 normally has the shape of a quadrilateral inplan view, it may have the shape of a circle, oval, triangle, hexagon orany other polygon in plan view. In addition, although the elementstructure 1 made up of the light-emitting element 20, thelight-transmissive member 30, and the light-reflective member 40 alsonormally has the shape of a quadrilateral in plan view, it may have theshape of a circle, oval, triangle, hexagon or any other polygon in planview.

The light-emitting element 20 is preferably formed of a semiconductor,examples of which include Group III-V compound semiconductors and GroupII-VI compound semiconductors. As the semiconductor, a nitride-basedsemiconductor such as In_(x)Al_(y)Ga_(1-x-y)N (0≤X, 0≤Y, X+Y≤1) ispreferably used. InN, AlN, GaN, InGaN, AlGaN, InGaAlN and the like canalso be used.

Light-Transmissive Member

The light-transmissive member 30 is disposed on the upper surface, i.e.,the light extraction surface, of the light-emitting element 20. Thelight-transmissive member 30 protects the light-emitting element 20 fromexternal forces, dust, moisture, and the like, and improves the heatresistant properties, weather resistant properties, and light resistantproperties of the light-emitting element 20. Examples of the material ofthe light-transmissive member 30 include thermosetting resins,thermoplastic resins, modified resins of these resins, and hybrid resinsthat contain one or more of these resins. Specifically, the examplesinclude epoxy resins, modified epoxy resins, silicone resins, modifiedsilicone resins, and hybrid silicone resins.

The light-transmissive member 30 preferably contains a wavelengthconversion material, such as a phosphor that converts the wavelength oflight from the light-emitting element 20, to adjust the color of thelight to be emitted. Preferably, a cerium-activated yttrium aluminumgarnet (YAG)-based fluorescent material is used as the phosphor. Thelight-transmissive member 30 may contain a filler (e.g., a diffusingagent, a coloring agent, or the like). Preferable examples of the fillerinclude silica, titanium oxide, zirconium oxide, magnesium oxide, glass,a crystal or sintered body of a phosphor, and a sintered body of aphosphor and an inorganic binding material.

Light-Reflective Member

The light-reflective member 40 covers the lateral surfaces of thelight-emitting element 20 and the lateral surfaces of thelight-transmissive member 30 but does not cover the upper surface of thelight-transmissive member 30. The light-reflective member 40 serves toimprove the light extraction efficiency and is preferably formed of asynthetic resin such as a silicone resin containing a white pigment.Preferably, the white pigment is one selected from the group consistingof titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate,magnesium hydroxide, calcium carbonate, calcium hydroxide, calciumsilicate, magnesium silicate, barium titanate, barium sulfate, aluminumhydroxide, aluminum oxide, zirconium oxide, and silicon oxide, or is acombination of two or more materials selected from the foregoing group.

Cover

The cover 50 covers the light-emitting element 20 with a gaptherebetween. The cover 50 includes the upper portion 51 allowing thelight emitted from the light-emitting element 20 to transmit; thesidewall 52, which extends along a peripheral edge of the upper portion51; and the recess 54, whose bottom is defined by the upper portion 51and whose side is defined by the sidewall 52, and which is open towardthe substrate 10.

The upper portion 51 is located opposed to the light-emitting element 20with a gap therebetween, and serves to refract and transmit the lightfrom the light-emitting element 20 to be emitted within a desired angleof view. The external shape of the upper portion 51 is preferably acircle or oval in plan view, or may be a polygon such as a quadrilateralor hexagon.

The upper portion 51 has a lower surface opposed to the light-emittingelement 20. The lower surface preferably includes a Fresnel lens surface5 composed of a plurality of annular projections 7. The upper portion 51may be a convex lens or a concave lens. The Fresnel lens surface 5 ofthe upper portion 51 preferably includes: a central projection 6 that isconvex toward the light-emitting element 20; and a plurality of annularprojections 7 formed around and concentrically with the centralprojection 6 being convex toward the light-emitting element 20.Preferably, each of the plurality of annular projections 7 is locatedconcentrically with the central projection 6 in plan view and is formedin an annular shape following the shape of the central projection 6.More specifically, when the central projection 6 is circular in planview, each of the plurality of projections 7 is formed in the shape of acircular ring in plan view; and when the central projection 6 isrectangular in plan view, each of the plurality of projections 7 isformed in the shape of a rectangular ring in plan view. Preferably, eachof the plurality of projections 7 is formed to provide the function ofthe Fresnel lens surface 5, which refracts the light from thelight-emitting element 20. Preferably, the Fresnel lens surface 5 isdimensioned to include the element structure 1 completely in plan view.

The upper portion 51 has a flat configuration on the opposite side ofthe Fresnel lens surface 5 of the upper portion 51. As an example, thesidewall 52 is formed continuously with the lateral side of the upperportion 51 in a cylindrical shape. Preferably, the cover 50 is fixed tothe substrate 10 by the lower surface of the sidewall 52 being fixed tothe upper surface of the substrate 10 with an adhesive membertherebetween. Here, the adhesive member may be a known adhesive materialsuch as an adhesive tape. As an example, the upper portion 51 and thesidewall 52 of the cover 50 are monolithically formed by processing asingle member. Incidentally, the upper portion 51 may be formed of alight-transmissive resin or a glass and the sidewall 52 may be formed ofa resin (a resin different from that of the upper portion 51).

Preferably, the upper portion 51 is harder than the fixing member 15.With this configuration, the upper portion 51 can be inhibited frombeing deformed. In addition, the sidewall 52 is preferably harder thanthe fixing member 15. With this configuration, the sidewall 52 can beinhibited from being deformed. It is preferable that the upper portion51 and the sidewall 52 be harder than the fixing member 15, because thecover 50 can be inhibited from being deformed.

Examples of the material of the upper portion 51 include thermosettingresins, thermoplastic resins, modified resins of these resins, andhybrid resins that contain one or more of these resins. Specifically,the examples include epoxy resins, modified epoxy resins, siliconeresins, modified silicone resins, hybrid silicone resins, andpolycarbonate resins. Examples of the material of the upper portion 51further include hybrid glasses. Examples of the material of the sidewall52 include thermosetting resins, thermoplastic resins, modified resinsof these resins, and hybrid resins that contain one or more of theseresins. Specifically, the examples include epoxy resins, modified epoxyresins, silicone resins, modified silicone resins, hybrid siliconeresins, and polycarbonate resins. Examples of the material of thesidewall 52 further include hybrid glasses.

Preferably, the cover 50 is constituted by a hard member that is harderthan the below-described soft material. Examples of the material of thehard member include polycarbonate resins, epoxy resins, and hybridglasses. Preferably, the hard member is formed of a polycarbonate resin.Polycarbonate resins are preferable in terms of the easiness inprocessing and appropriate hardness.

Preferably, the cover 50 is formed of a resin, and the fixing member 15is formed of a resin softer than the resin of the cover 50. With thisconfiguration, the cover 50 is easy to fabricate and the light-emittingdevice 100 is easily engaged with a casing 70.

Fixing Member

The fixing member 15 is disposed so as to project from a part of theouter lateral surface of the sidewall 52 of the cover 50. The fixingmember 15 is partially inserted into the sidewall 52.

The fixing member 15 is formed of a soft material that is deformable dueto a pressing force generated in the event of an engagement with acounterpart member. Hear, an example of the counterpart member is acasing 70 used in a mobile phone. The feature of the fixing member 15being deformable due to a pressing force allows the fixing member 15 tobe deformed in such a way as to fix the light-emitting device 100 to thecasing 70 when the cover 50 is fitted in a through-hole 71 of the casing70. The fixing member 15 is deformed such that, when the original heightof the fixing member from the sidewall 52 is 1, the height from thesidewall 52 decreases preferably to a height 0.2 to 0.9 times theoriginal height, or more preferably to a height 0.4 to 0.7 times theoriginal height. Such deformation enhances the fixation strength of thecover 50 when it is fitted into the casing 70.

The light-emitting device 100 being fixed to the casing 70 using thefixing member 15 makes it possible to reduce the thickness of thelight-emitting device and the illumination device.

The fixing member 15 may be covered by a thin film 55 formed of the samematerial of the sidewall 52 of the cover 50. The thin film 55 isdescribed in the below-described manufacturing method in detail.

Hereinbelow, the fixing member 15 is further described taking the casing70 as an example of the counterpart member.

Examples of the material of the fixing member 15 include thermosettingresins, thermoplastic resins, modified resins of these resins, andhybrid resins that contain one or more of these resins. Specifically,the examples include epoxy resins, modified epoxy resins, siliconeresins, modified silicone resins, and hybrid silicone resins. Examplesof the material of the fixing member 15 further include hybrid glasses.

The soft material used for the fixing member 15 is preferably a siliconeresin. Silicone resins are preferable because they are easily deformeddue to a pressing force generated in the event of an engagement with thecasing 70 and have good light resistant properties and good heatresistant properties.

The fixing member 15 projecting from the outer lateral surface of thesidewall 52 has a distal end portion having an arc-shaped cross section.This configuration allows the cover 50 to slide smoothly when it isfitted into the casing 70, and thereby the cover 50 is easily fittedinto the casing 70. However, the cross-sectional shape of the fixingmember 15 can be any other shape so long as the fixing member 15 isdeformed due to a pressing force generated in the event of an engagementwith the casing 70 and as a result the light-emitting device 100 isfixed to the casing 70. For example, the cross-sectional shape of thefixing member 15 projecting from the outer lateral surface of thesidewall 52 may be a quadrilateral, triangle, half circle, or half oval.

The fixing member 15 preferably extends continuously along the outerlateral surface of the sidewall 52 in a loop shape in plan view. Withthis configuration, the light-emitting device 100 is easily engaged withthe casing 70 in a stable manner. In addition, it is easy to form thefixing member 15 on the outer lateral surface of the sidewall 52 whenfabricating the light-emitting device 100.

The fixing member 15 is preferably disposed at such a height positionrelative to the height of the sidewall 52 that (i) the height positionis lower than an uppermost area a1 extending downward from the upper endof the outer lateral surface of the sidewall 52 by a length of 10% ofthe height of the sidewall 52, and (ii) the height position is higherthan a lowermost area a2 extending upward from the lower end of theouter lateral surface of the sidewall 52 by a length of 10% of theheight of the sidewall 52. With this configuration, the light-emittingdevice 100 is easily engaged with the casing 70 in a stable manner.

Hard-Coat Layer

The hard-coat layer 60 covers the upper surface of the cover 50. Thehard-coat layer 60 is a member that is harder than the cover 50. Thehard-coat layer 60 has light-transmissive properties and continuouslycovers the upper surface of the upper portion 51 of the cover 50 and theupper surface of the sidewall 52 of the cover 50. The light-emittingdevice 100 restrains the deformation of the cover 50 by being providedwith the hard-coat layer 60. Providing the hard-coat layer 60 protectsthe upper surface of the cover 50 from external forces, dust, moistureor the like, and inhibits the upper surface from being scratched.

Examples of the material of the hard-coat layer 60 include thermosettingresins, thermoplastic resins, modified resins of these resins, andhybrid resins that contain one or more of these resins. Specifically,the examples include acrylic resins, epoxy resins, modified epoxyresins, silicone resins, modified silicone resins, hybrid siliconeresins, and polycarbonate resins.

Operation of Light-Emitting Device

Next, a description will be given of the operation of the light-emittingdevice 100.

When the light-emitting device 100 is driven, the light-emitting element20 is supplied with current from an external power source. As a result,the light-emitting element 20 emits light. The light emitted by thelight-emitting element 20 includes light that travels upward, passesthrough the light-transmissive member 30, comes out of thelight-transmissive member 30, and enters the upper portion 51 of thecover 50. The light emitted by the light-emitting element 20 includeslight that travels downward, reflects back off the substrate 10, passesthrough the light-transmissive member 30, comes out of thelight-transmissive member 30, and enters the upper portion 51 of thecover 50. The light emitted by the light-emitting element 20 includeslight that travels in a lateral direction, reflects back off thelight-reflective member 40, passes through the light-transmissive member30, comes out of the light-transmissive member 30, and enters the upperportion 51 of the cover 50. In the upper portion 51 of the cover 50, thelight coming from a central portion of the element structure 1 entersthe central projection 6 and exits in the optical axis direction and inthe focusing directions. In addition, in the upper portion 51 of thecover 50, the light coming from the element structure 1 other than thecentral portion thereof enters the projections 7 of the Fresnel lenssurface 5 and is refracted at an angle within the desired angle of viewand exits from the upper portion 51. That means, the upper portion 51 ofthe cover 50 causes the light incident on the projections 7 to berefracted and exit from the upper portion 51, to thereby improve thelight emission efficiency in the desired angle of view. In this way, thelight emitted by the light-emitting element 20 is extracted to theoutside of the light-emitting device 100.

Method for Manufacturing Light-Emitting Device

Next, a description will be given of an example of a method formanufacturing the light-emitting device 100.

FIG. 2 shows a flowchart of a method for manufacturing thelight-emitting device according to the first embodiment. FIG. 3A is across-sectional view illustrating a step of fabricating a cover and afixing member in the method for manufacturing the light-emitting deviceaccording to the first embodiment. FIG. 3B is a cross-sectional viewillustrating a step of forming a hard-coat layer in the method formanufacturing the light-emitting device according to the firstembodiment. FIG. 3C is a cross-sectional view illustrating a step ofdisposing a light-emitting element on a substrate in the method formanufacturing the light-emitting device according to the firstembodiment. FIG. 3D is a cross-sectional view illustrating a step offorming a light-reflective member in the method for manufacturing thelight-emitting device according to the first embodiment. FIG. 3E is across-sectional view illustrating a step of disposing the cover in themethod for manufacturing the light-emitting device according to thefirst embodiment. Note that, as it is preferable to dispose alight-emitting element 20 with a light-reflective member 40 on asubstrate 10, the step illustrated in FIG. 3C may be omitted to startthe manufacturing of the light-emitting device 100 from the stepillustrated in FIG. 3D.

A method for manufacturing the light-emitting device 100 includes: acover and fixing member fabrication step S101 including sandwiching afixing member 15 by a molding device 80 and injecting alight-transmissive material into a space defined in the molding device80, hardening or curing the injected light-transmissive material to forma cover 50 including an upper portion 51 and a sidewall 52 extendingalong a peripheral edge of the upper portion 51, the cover 50 having arecess 54 defined by the upper portion 51 and the sidewall 52, the cover50 being integrated with the fixing member 15 such that the fixingmember 15 projects from a part of an outer lateral surface of thesidewall 52; a hard-coat layer forming step S102 including forming ahard-coat layer 60 on an upper surface of the cover 50; alight-transmissive member disposing step S103 including disposing alight-transmissive member 30 on a light extraction surface of alight-emitting element 20 to be disposed on a substrate 10; alight-emitting element mounting step S104 including mounting thelight-emitting element 20 on the substrate 10 so that thelight-transmissive member 30 is located on the upper side of thelight-emitting element 20; a light-reflective member forming step S105including forming a light-reflective member 40 that covers the lateralsurface of the light-emitting element 20 and the lateral surface of thelight-transmissive member 30; and a cover disposing step S106 includingdisposing the cover 50 so that the light-emitting element 20 is housedin the recess 54.

The fixing member 15, which is used in the cover and fixing memberfabrication step S101, is made of a soft material that is deformable dueto a pressing force generated in the event of an engagement with acounterpart member.

The materials and arrangement of the members are substantially the sameas or similar to those of the above-described light-emitting device 100,and therefore descriptions thereof will be omitted as appropriate.

Cover and Fixing Member Fabrication Step

The cover and fixing member fabrication step S101 includes sandwiching afixing member 15 with a molding device 80 and injecting alight-transmissive material into a space defined in the molding device80, and hardening or curing the light-transmissive material. In the stepS101, produced as a result of hardening or curing the light-transmissivematerial are a cover 50 and a fixing member 15 projecting from a part ofan outer lateral surface of the cover 50. The cover 50 includes an upperportion 51 and a sidewall 52 extending along the peripheral edge of theupper portion 51. The upper portion 51 and the sidewall 52 togetherdefine a recess 54. The upper portion 51 defines a bottom of the recess54, and the sidewall 52 defines a lateral side of the recess 54.

The step S101 provides an upper mold 81 and a lower mold 82, whichconstitute the molding device 80, and the fixing member 15, which isformed in a loop shape in advance. Subsequently, the fixing member 15 issandwiched between the upper mold 81 and the lower mold 82, and then thelight-transmissive material is injected into a space defined by theupper mold 81 and the lower mold 82 via a resin injection port 85. Inthis event, the light-transmissive material spreads over the surface ofthe fixing member 15 projecting from the part of the outer lateralsurface of the sidewall 52. As a result, the fixing member 15 is coveredby a thin film 55 (see FIG. 1E). Subsequently, the light-transmissivematerial injected into the space is hardened or cured, and then themolding device 80 is detached. In this way, the cover 50 provided withthe fixing member 15 projecting from the part of the outer lateralsurface of the sidewall 52 is produced. Here, “hardening” means, in acase in which a thermoplastic resin is to be used as thelight-transmissive material, cooling the thermoplastic resin having beenheated and melted to solidify the thermoplastic resin. Here, “curing”means, in a case in which a thermosetting resin is to be used as thelight-transmissive material, heating the thermosetting resin in a liquidstate to solidify the thermosetting resin.

In the step S101, the molding device 80 may include a left mold and aright mold in addition to the upper mold and the lower mold.

Hard-Coat Layer Forming Step

The hard-coat layer forming step S102 includes forming a hard-coat layer60 on an upper surface of the cover 50.

In the step S102, the hard-coat layer 60 is formed continuously on theupper surface of the upper portion 51 of the cover 50 and the uppersurface of the sidewall 52 of the cover 50 by a spray method or byaffixing a resin sheet or the like, for example.

Light-Transmissive Member Disposing Step

The light-transmissive member disposing step S103 includes disposing alight-transmissive member 30 on a light extraction surface of alight-emitting element 20 to be disposed on a substrate 10.

In the step S103, for example, the light-transmissive member 30 having apredetermined shape is bonded to the light extraction surface of thelight-emitting element 20. In the event of bonding thelight-transmissive member 30 to the light-emitting element 20, thelight-transmissive member 30 may be directly bonded to thelight-emitting element 20 or may be bonded via bonding member withlight-transmissive properties. Alternatively, the light-transmissivemember 30 may be formed by a spray method.

Light-Emitting Element Mounting Step

The light-emitting element mounting step S104 includes mounting thelight-emitting element 20 on the substrate 10 so that thelight-transmissive member 30 is located on the upper side of thelight-emitting element 20.

The light-emitting element 20 has an electrode formation surface as amounting surface and is flip-chip mounted on wiring formed on thesubstrate 10 via a conductive bonding member. Examples of the conductivebonding member include a eutectic solder, a conductive paste, and bumps.

Note that the light-transmissive member disposing step S103 and thelight-emitting element mounting step S104 may not necessarily be clearlydistinguished. For example, the light-emitting element 20 may bedisposed on the substrate 10 and then bonded to the light-transmissivemember 30.

Light-Reflective Member Forming Step

The light-reflective member forming step S105 includes forming alight-reflective member 40 that covers the lateral surface of thelight-emitting element 20 and the lateral surface of thelight-transmissive member 30.

In the step S105, for example, the light-reflective member 40 is formedby supplying resin or the like to-constitute the light-reflective member40 on the substrate 10 by using a discharge device (dispenser) that ismoveable in the up-down direction, in the horizontal direction or thelike relative to the substrate 10. Alternatively, the light-reflectivemember 40 may be formed by compression molding, transfer molding, or thelike.

The light-reflective member 40 is preferably formed before thelight-emitting element 20 is disposed on the substrate 10. Morespecifically, it is preferable to dispose the light-transmissive member30 on the upper surface of the light-emitting element 20, then disposethe light-reflective member 40 on the lateral surface of thelight-emitting element 20 and on the lateral surface of thelight-transmissive member 30, and then dispose the light-emittingelement 20, on which the light-transmissive member 30 and thelight-reflective member 40 has been disposed, on the substrate 10. Thismakes it easy to form the light-emitting element 20 provided with thelight-reflective member 40 and reduces the heat transferred to thesubstrate 10 and reduces the pressure applied to the substrate 10.

Cover Disposing Step

The cover disposing step S106 includes disposing the cover 50 so thatthe light-emitting element 20 is housed in the recess 54.

In the step S106, a lower surface of the sidewall 52 of the cover 50 isfixed to the upper surface of the substrate 10 with an adhesive membertherebetween. As a result, the light-emitting element 20 is housed inthe recess 54 of the cover 50.

Illumination Device

FIG. 4 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the firstembodiment.

The illumination device 200 according to the first embodiment includesthe above-described light-emitting device 100 and a counterpart memberconstituted by a casing 70 having a through-hole 71. The light-emittingdevice 100 is fixed to the casing 70 of the illumination device 200 bythe fixing member 15 of the light-emitting device 100 being in contactwith the inner surface of the through-hole 71 of the casing 70 in astate of being deformed.

The light-emitting device 100 is structured as described above.

Casing

The casing 70 has the through-hole 71. The casing 70 is a member towhich the light-emitting device 100 is to be fixed. The casing 70 may bea part of the casing of a mobile phone that employs the light-emittingdevice 100 as a flashlight light source.

The size of the through-hole 71 is larger than the size of the cover 50in plan view such that the upper surface of the cover 50, which is theupper surface of the hard-coat layer 60, is exposed. The size of thethrough-hole 71 is smaller than the size of the light-emitting device100 including the size of the fixing member 15 in plan view. With thisstructure, in the illumination device 200, the fixing member 15 is incontact with the inner surface of the through-hole 71 of the casing 70and is deformed by being pressed due to the pressure from the innersurface, and whereby the light-emitting device 100 is fixed to thecasing 70. The casing 70 is preferably formed of a light-blockingmaterial. To restrict the light distributing angle by which the lightemitted from the light-emitting device 100 is to be distributed, thecasing 70 is preferably formed of a light-reflective resin in which afiller is contained to reflect light, a light-absorbing resin thatabsorbs light, or the like. Preferably, the through-hole 71 has theshape of a circle, oval, triangle, quadrilateral, hexagon or the like inplan view.

Method for Manufacturing Illumination Device

Next, a description will be given of an example of a method formanufacturing the illumination device 200.

FIG. 5 shows a flowchart of a method for manufacturing the illuminationdevice according to the first embodiment.

The method for manufacturing the illumination device 200 includes: alight-emitting device providing step S11 including providing alight-emitting device 100 using the method for manufacturing thelight-emitting device 100; and a light-emitting device fixing step S12including fixing the light-emitting device 100 in the counterpartmember, which is constituted by the casing 70 having the through-hole71, so that the fixing member 15 of the light-emitting device 100 comesin contact with the inner surface of the through-hole 71 of the casing70 in a state of being deformed.

The materials and arrangement of the members are substantially the sameas or similar to those of the above-described illumination device 200,and therefore descriptions thereof will be omitted as appropriate.

Light-Emitting Device Providing Step

The light-emitting device providing step S11 includes providing thelight-emitting device 100 using the above-described method formanufacturing the light-emitting device 100.

In the step S11, the light-emitting device 100 is manufactured bycarrying out steps S101 to S106 described above.

Light-Emitting Device Fixing Step

The light-emitting device fixing step S12 includes fixing thelight-emitting device 100 in a counterpart member, constituted by thecasing 70 having the through-hole 71, so that the fixing member 15 ofthe light-emitting device 100 comes in contact with the inner surface ofthe through-hole 71 of the casing 70 in a state of being deformed.

In the step S12, the light-emitting device 100 is engaged with casing 70by inserting the light-emitting device 100 into the through-hole 71 ofthe casing 70 in such a manner that the upper portion 51 of the cover 50is inserted earlier and that the fixing member 15 is brought intocontact with the inner surface of the through-hole 71 of the casing 70.In this event, as the fixing member 15 is formed of a soft material thatis deformable due to a pressing force generated in the event of theengagement with the casing 70, the fixing member 15 gets deformed whenbeing brought into contact with the inner surface of the through-hole 71of the casing 70, and as a result, the light-emitting device 100 isfixed in the casing 70.

Incidentally, for example, the casing 70 may be constituted by an uppermember having the through-hole 71 and a lower member. In this case, thelight-emitting device 100 is first inserted into the through-hole 71from the lower side of the upper member, and then, the upper member andthe lower member are joined.

Second Embodiment

Light-Emitting Device

FIG. 6A is a plan view schematically illustrating the configuration of alight-emitting device according to a second embodiment. FIG. 6B is across-sectional view taken along line VIB-VIB in FIG. 6A.

A light-emitting device 100A according to the second embodiment isprovided with a fixing member 15A projecting from a part of the outerlateral surface of the sidewall 52 of a cover 50A without beingpartially inserted in the sidewall 52. In addition, the fixing member15A is not covered by a thin film formed of the material of the sidewall52 of the cover 50A.

As the same as or similar to the fixing member 15, the fixing member 15Ais formed of a soft material that is deformable due to a pressing forcegenerated in the event of an engagement with a counterpart member.

The features of the light-emitting device 100A other than thosedescribed above are substantially the same as or similar to those of theabove-described light-emitting device 100 according to the firstembodiment.

Method for Manufacturing Light-Emitting Device

Next, a description will be given of an example of a method formanufacturing the light-emitting device 100A.

FIG. 7 shows a flowchart of a method for manufacturing thelight-emitting device according to the second embodiment. FIG. 8A is across-sectional view illustrating a step of fabricating a cover in themethod for manufacturing the light-emitting device according to thesecond embodiment. FIG. 8B is a cross-sectional view illustrating a stepof forming a fixing member in the method for manufacturing thelight-emitting device according to the second embodiment.

The method for manufacturing the light-emitting device 100A includes: acover fabrication step S201 including injecting a light-transmissivematerial into a space defined by a molding device 80A and hardening orcuring the injected light-transmissive material to form a cover 50Aincluding an upper portion 51 and a sidewall 52 extending along aperipheral edge of the upper portion 51, the cover 50A having a recess54 defined by the upper portion 51 and the sidewall 52; a fixing memberforming step S202 including forming a fixing member 15A projecting froma part of an outer lateral surface of the sidewall 52; a hard-coat layerforming step S203 including forming a hard-coat layer 60 on an uppersurface of the cover 50A; a light-transmissive member disposing stepS204 including disposing a light-transmissive member 30 on a lightextraction surface of a light-emitting element 20 to be disposed on asubstrate 10; a light-emitting element mounting step S205 includingmounting the light-emitting element 20 on the substrate 10 so that thelight-transmissive member 30 is located on the upper side of thelight-emitting element 20; a light-reflective member forming step S206including forming a light-reflective member 40 that covers the lateralsurface of the light-emitting element 20 and the lateral surface of thelight-transmissive member 30; and a cover disposing step S207 includingdisposing the cover 50A so that the light-emitting element 20 is housedin the recess 54.

The fixing member 15A, which is formed in the fixing member forming stepS202, is formed of a soft material that is deformable due to a pressingforce generated in the event of an engagement with a counterpart member.

The materials and arrangement of the members are substantially the sameas or similar to described above regarding the structure of thelight-emitting device 100A, and therefore descriptions thereof will beomitted as appropriate.

In addition, steps S203 to S207 are substantially the same as or similarto the above-described steps S102 to S106, respectively, and thereforedescriptions thereof will be omitted as appropriate.

Cover Fabrication Step

The cover fabrication step S201 includes injecting a light-transmissivematerial into a space defined by a molding device 80A and hardening orcuring the injected light-transmissive material. In the step S201,produced as a result of hardening or curing the light-transmissivematerial is a cover 50A that includes an upper portion 51 and a sidewall52 extending along the peripheral edge of the upper portion 51 and has arecess 54 whose bottom is defined by the upper portion 51 and whose sideis defined by the sidewall 52.

In the step S201, an upper mold 81A and a lower mold 82A, whichconstitute the molding device 80A, are provided. Subsequently,light-transmissive material is injected into a space defined by theupper mold 81 a and the lower mold 82A via a resin injection port 85.Subsequently, the light-transmissive material injected into the space ishardened or cured and then the molding device 80A is detached. In thisway, the cover 50A is produced.

Fixing Member Forming Step

The fixing member forming step S202 include forming a fixing member 15Aon an outer lateral surface of the sidewall 52 such that the fixingmember 15A projects from a part of the outer lateral surface of thesidewall 52.

In the step S202, for example, the cover 50A is placed in a moldingdevice 80B, and then the fixing member 15A is formed on the outerlateral surface of the sidewall 52 by injection molding, transfermolding, or compression molding.

In the step S202, for example, an upper mold 81B, a lower mold 82B, aleft mold 83, and a right mold 84, which constitute the molding device80B, are provided. Subsequently, the raw material of the fixing member15A is injected into a space defined by the molding device 80B via aresin injection port 85. Subsequently, the raw material injected intothe space is hardened or cured and then the molding device 80B isdetached. In this way, the fixing member 15A is formed on the outerlateral surface of the sidewall 52 of the cover 50A.

Illumination Device

FIG. 9 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the secondembodiment.

An illumination device 200A according to the second embodiment includesthe above-described light-emitting device 100A and a counterpart memberconstituted by a casing 70 having a through-hole 71. The light-emittingdevice 100A is fixed to the casing 70 of the illumination device 200A bythe fixing member 15A of the light-emitting device 100A being in contactwith the inner surface of the through-hole 71 of the casing 70 in astate of being deformed.

The illumination device 200A is substantially the same as or similar tothe illumination device 200 according to the first embodiment exceptthat the above-described light-emitting device 100A is used in place ofthe light-emitting device 100.

Method for Manufacturing Illumination Device

Next, a description will be given of an example of a method formanufacturing the illumination device 200A.

The method for manufacturing the illumination device 200A issubstantially the same as or similar to the method for manufacturing theillumination device 200 according to the first embodiment except thatthe light-emitting device 100A provided by the above-described methodfor manufacturing the light-emitting device 100A is used in place of thelight-emitting device 100.

Third Embodiment

Light-Emitting Device

FIG. 10A is a plan view schematically illustrating the configuration ofa light-emitting device according to the third embodiment. FIG. 10B is across-sectional view taken along line XB-XB in FIG. 10A.

A light-emitting device 100B according to the third embodiment has acover 50B with a sidewall 52 having an outer lateral surface on a partof which a projected portion 53 is formed. The fixing member 15B coversthe projected portion 53. The projected portion 53 can be encapsulatedby the fixing member 15B so as to be positioned inside thereof. Withthis configuration, the fixing member 15B can easily be firmly fixed tothe outer lateral surface of the sidewall 52.

The projected portion 53 is formed monolithically with the sidewall 52by molding them together from the same material.

The fixing member 15B is, like the fixing member 15A, formed of a softmaterial that is deformable due to a pressing force generated in theevent of an engagement with a counterpart member.

Preferably, the projected portion 53 is formed on the entirety of thepart of the sidewall 52 where the fixing member 15B is to be provided.For example, in a case in which the fixing member 15B is to be formedcontinuously on the outer lateral surface of the sidewall 52 in a loopshape in plan view, the projected portion 53 is preferably formedcontinuously on the outer lateral surface of the sidewall 52 in a loopshape in plan view. With this configuration, the fixing member 15B caneasily be more firmly fixed to the outer lateral surface of the sidewall52. In addition, the projected portion 53 is easily formed on the outerlateral surface of the sidewall 52 in the process of manufacturing thelight-emitting device 100B.

The projected portion 53 has a quadrilateral cross section. With thisstructure, the fixing member 15B can easily be firmly fixed to the outerlateral surface of the sidewall 52. The cross-sectional shape of theprojected portion 53 can be any shape so long as the fixing member 15Bis fixed to the outer lateral surface of the sidewall 52. For example,the cross-sectional shape of the projected portion 53 may be a triangle,a half circle, a half oval, or a shape with an arc-shaped distal end.

The features of the light-emitting device 100B other than thosedescribed above are substantially the same as or similar to those of theabove-described light-emitting device 100A according to the secondembodiment.

Method for Manufacturing Light-Emitting Device

Next, a description will be given of an example of a method formanufacturing the light-emitting device 100B.

FIG. 11A is a cross-sectional view illustrating a step of fabricating acover in the method for manufacturing the light-emitting deviceaccording to the third embodiment. FIG. 11B is a cross-sectional viewillustrating a step of disposing a fixing member in the method formanufacturing the light-emitting device according to the thirdembodiment.

In the method for manufacturing the light-emitting device 100B, theprojected portion 53 is formed on a part of the outer lateral surface ofthe sidewall 52 in the cover fabrication step S201 of theabove-described method for manufacturing light-emitting device 100A. Inthe method for manufacturing the light-emitting device 100B, the fixingmember 15B is formed so that the fixing member 15B covers the projectedportion 53, in the fixing member forming step S202 of theabove-described method for manufacturing light-emitting device 100A. Theprojected portion 53 can be encapsulated by the fixing member 15B so asto be positioned inside thereof. Except these matters, the method formanufacturing the light-emitting device 100B is substantially the sameas or similar to the method for manufacturing the light-emitting device100A according to the second embodiment. Hereinbelow, a description willbe given of the cover fabrication step of the method for manufacturingthe light-emitting device 100B and of the fixing member forming step ofthe method for manufacturing the light-emitting device 100B.

The cover fabrication step of the method for manufacturing thelight-emitting device 100B includes injecting a light-transmissivematerial into a space defined by a molding device 80C and hardening orcuring the injected light-transmissive material. In this step, producedas a result of hardening or curing the light-transmissive material is acover 50B that includes an upper portion 51 and a sidewall 52 extendingalong the peripheral edge of the upper portion 51. The cover 50B has arecess 54 whose bottom is defined by the upper portion 51 and whose sideis defined by the sidewall 52. The cover 50B has a projected portion 53on a part of an outer lateral surface of the sidewall 52.

In this step, an upper mold 81C, a lower mold 82C, a left mold 83A, anda right mold 84A, which constitute the molding device 80C, are provided.Subsequently, the light-transmissive material is injected into the spacedefined by the molding device 80C via a resin injection port 85.Subsequently, the light-transmissive material injected into the space ishardened or cured and then the molding device 80C is detached. In thisway, the cover 50B is produced.

In the fixing member forming step of the method for manufacturing thelight-emitting device 100B, a fixing member 15B is formed so as toproject from the part of the outer lateral surface of the sidewall 52.

In this step, for example, the fixing member 15B, which has beenprovided in advance, is disposed on the outer lateral surface of thesidewall 52 in such a way that the projected portion 53 is inserted intothe fixing member 15B. As the fixing member 15B is formed of a softmaterial, it is easily fitted over the projected portion 53.

Alternatively, in this step, like the above-described method formanufacturing the light-emitting device 100A, the fixing member 15B canbe formed in such a way that the cover 50B is placed in a molding deviceand then the fixing member 15B is formed on the outer lateral surface ofthe sidewall 52 by injection molding, transfer molding, or compressionmolding (see FIG. 8B).

Illumination Device

FIG. 12 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the thirdembodiment.

An illumination device 200B according to the third embodiment includesthe above-described light-emitting device 100B and a counterpart memberconstituted by a casing 70 having a through-hole 71. The light-emittingdevice 100B is fixed to the casing 70 of the illumination device 200B bythe fixing member 15B of the light-emitting device 100B being in contactwith the inner surface of the through-hole 71 of the casing 70 in astate of being deformed.

The illumination device 200B is substantially the same as or similar tothe illumination device 200 according to the first embodiment exceptthat the above-described light-emitting device 100B is used in place ofthe light-emitting device 100.

Method for Manufacturing Illumination Device

Next, a description will be given of an example of a method formanufacturing the illumination device 200B.

The method for manufacturing the illumination device 200B issubstantially the same as or similar to the method for manufacturing theillumination device 200 according to the first embodiment except thatthe light-emitting device 100B provided by the above-described methodfor manufacturing the light-emitting device 100B is used in place of thelight-emitting device 100.

Fourth Embodiment

Light-Emitting Device

FIG. 13A is a plan view schematically illustrating the configuration ofa light-emitting device according to the fourth embodiment. FIG. 13B isa cross-sectional view taken along line XIIIB-XIIIB in FIG. 13A.

A light-emitting device 100C according to the fourth embodiment has thecover 50A and a fixing member 15C that covers the outer lateral surfaceof the sidewall 52 of the cover 50A. The fixing member 15C is providedon the entirety of the outer lateral surface of the sidewall 52 of thecover 50A. With this configuration, the light-emitting device 100C iseasily engaged with the casing 70 in a stable manner. In addition, thefixing member 15C is easily formed on the outer lateral surface of thesidewall 52 in the process of manufacturing the light-emitting device100C.

Like the fixing member 15, the fixing member 15C is formed of a softmaterial that is deformable due to a pressing force generated in theevent of the engagement with a counterpart member.

The features of the light-emitting device 100C other than those describeabove are substantially the same as or similar those of theabove-described light-emitting device 100 according to the firstembodiment.

Method for Manufacturing Light-Emitting Device

Next, a description will be given of an example of a method formanufacturing the light-emitting device 100C.

FIG. 14 is a cross-sectional view illustrating a step of forming afixing member in the method for manufacturing the light-emitting deviceaccording to the fourth embodiment.

The method for manufacturing the light-emitting device 100C includes: acover fabrication step including injecting a light-transmissive materialinto a space defined by a molding device 80D and hardening or curing theinjected light-transmissive material to form a cover 50A including anupper portion 51, a sidewall 52 extending along a peripheral edge of theupper portion 51, and a recess 54 defined by the upper portion 51 andthe sidewall 52; a fixing member forming step including forming a fixingmember 15C on an outer lateral surface of the sidewall 52 so as to coverthe outer lateral surface; a hard-coat layer forming step includingforming a hard-coat layer 60 on an upper surface of the cover 50A; alight-transmissive member disposing step including disposing alight-transmissive member 30 on a light extraction surface of alight-emitting element 20 to be disposed on a substrate 10; alight-emitting element mounting step including mounting thelight-emitting element 20 on the substrate 10 so that thelight-transmissive member 30 is located on the upper side of thelight-emitting element 20; a light-reflective member forming stepincluding forming a light-reflective member 40 that covers the lateralsurface of the light-emitting element 20 and the lateral surface of thelight-transmissive member 30; and a cover disposing step includingdisposing the cover 50A so that the light-emitting element 20 is housedin the recess 54.

The fixing member 15C, which is used in the fixing member forming step,is formed of a soft material that is deformable due to a pressing forcegenerated in the event of an engagement with a counterpart member.

In the method for manufacturing the light-emitting device 100C, in thefixing member forming step S202 of the above-described method formanufacturing the light-emitting device 100A, the fixing member 15C isformed on the outer lateral surface of the sidewall 52 of the cover 50Asuch that the fixing member 15C covers the outer lateral surface. Exceptthis, the method for manufacturing the light-emitting device 100C issubstantially the same as or similar to that for the light-emittingdevice 100A according to the second embodiment. Hereinbelow, adescription will be given of the fixing member forming step of themethod for manufacturing the light-emitting device 100C.

In the fixing member forming step of the method for manufacturing thelight-emitting device 100C, the fixing member 15C is formed on the outerlateral surface of the sidewall 52 of the cover 50A such that the fixingmember 15C covers the outer lateral surface.

In this step, for example, the cover 50A is placed in the molding device80D, and then the fixing member 15C is formed on the entirety of theouter lateral surface of the sidewall 52 by injection molding, transfermolding, or compression molding.

In this step, for example, an upper mold 81D, a lower mold 82D, a leftmold 83B, and a right mold 84B, which constitute the molding device 80D,are provided. Subsequently, the raw material of the fixing member 15C isinjected into a space defined by molding device 80D via a resininjection port 85. Subsequently, the raw material injected into thespace is hardened or cured and then the molding device 80D is detached.In this way, the fixing member 15C is formed on the outer lateralsurface of the sidewall 52 of the cover 50A.

Illumination Device

FIG. 15 is a cross-sectional view schematically illustrating theconfiguration of an illumination device according to the fourthembodiment.

An illumination device 200C according to the fourth embodiment includesthe above-described light-emitting device 100C and a counterpart memberconstituted by the casing 70 having the through-hole 71. Thelight-emitting device 100C is fixed to the casing 70 of the illuminationdevice 200C by the fixing member 15C of the light-emitting device 100Cbeing in contact with the inner surface of the through-hole 71 of thecasing 70 in a state of being deformed. Although the fixing member 15Cis provided over the entirety of the outer lateral surface of thesidewall 52 of the cover 50, the fixing member 15C is deformed only atthe portion thereof that is in contact with the inner surface of thethrough-hole 71 of the casing 70.

The illumination device 200C is substantially the same as or similar tothe illumination device 200 according to the first embodiment exceptthat the above-described light-emitting device 100C is used in place ofthe light-emitting device 100.

Method for Manufacturing Illumination Device

Next, a description will be given of an example of a method formanufacturing the illumination device 200C.

The method for manufacturing the illumination device 200C issubstantially the same as or similar to the method for manufacturing theillumination device 200 according to the first embodiment except thatthe light-emitting device 100C provided by the above-described methodfor manufacturing the light-emitting device 100C is used in place of thelight-emitting device 100.

In the foregoing description, the light-emitting devices, theillumination devices, and the methods for manufacturing them have beenspecifically described with reference to the embodiments of theinventions. However, the scope of the present invention is not limitedthereto and should be construed broadly on the basis of the scope ofclaims. In addition, various modifications and variations made on thebasis of the above description are also included in the scope of thepresent invention.

Other Embodiment

FIG. 16 is a cross-sectional view schematically illustrating theconfiguration of a light-emitting device according to anotherembodiment.

A light-emitting device 100D has two loop-shaped fixing members 15Aarranged side-by-side in the height direction of the sidewall 52. Withthis configuration, the light-emitting device 100D can be more stablyengaged with the casing. More in general, the light-emitting device andthe illumination device may have a plurality of loop-shaped fixingmembers 15A arranged side-by-side in the height direction of thesidewall 52.

Incidentally, when a plurality of fixing members 15A are to be arranged,it is preferable that at least one of the plurality of fixing members15A is disposed at such a height position relative to the height of thesidewall 52 that (i) the height position is lower than an uppermost areaextending downward from the upper end of the outer lateral surface ofthe sidewall 52 by a length of 10% of the height of the sidewall 52, and(ii) the height position is higher than a lowermost area extendingupward from the lower end of the outer lateral surface of the sidewall52 by a length of 10% of the height of the sidewall 52. Moreover, it ismore preferable that all the plurality of fixing members 15A are eachdisposed at a height position lower than the uppermost area by a lengthof 10% of the height of the sidewall 52 and higher than the lowermostarea by a length of 10% of the height of the sidewall 52. With thisconfiguration, the light-emitting device is easily engaged with thecasing in a stable manner.

Alternatively, a plurality of loop-shaped fixing members, each of whichis like the fixing member 15 illustrated in FIG. 1C, may be arrangedside-by-side in the height direction of the sidewall 52. Stillalternatively, a plurality of projected portions each of which is likethe loop-shaped projected portion 53 illustrated in FIG. 10B may bearranged side-by-side in the height direction of the sidewall 52. Inthis case, a plurality of the loop-shaped fixing members each of whichis like the fixing member 15B is formed side-by-side in the heightdirection of the sidewall 52 so that each of the fixing members coversor encapsulates a respective one of the projected portions.

Moreover, for example, the light-emitting device and/or thelight-emitting device of the illumination device may or may not beprovided with the hard-coat layer. Moreover, the light-emitting deviceand/or the light-emitting device of the illumination device may or maynot be provided with the light-reflective member.

The method of manufacturing the light-emitting device and the method ofmanufacturing the illumination device may include another step or othersteps between two of, or before or after one of the above-describedsteps, so long as the another step or the other steps do not adverselyaffect the above-described steps. For example, a step of removingforeign matter mixed in the process of manufacturing may be inserted inthe process steps.

It should be noted that some of the steps of the method formanufacturing the light-emitting device and the method of manufacturingthe illumination device are not limited to the order as described. Theorder in which they are carried out may be changed. For example, thecover and fixing member fabrication step and the cover fabrication stepmay be carried out after the light-transmissive member disposing step,after the light-emitting element mounting step, or after thelight-reflective member forming step. In addition, the hard-coat layerforming step may be carried out after the light-transmissive memberdisposing step, after the light-emitting element mounting step, afterthe light-reflective member forming step, or after the cover disposingstep.

The light-emitting devices and the illumination devices according to theembodiments described above can be used for lighting purposes, forexample, for flashlight light sources or the like of mobile phones andcameras.

What is claimed is:
 1. A light-emitting device comprising: a substrate;a light-emitting element disposed on the substrate; a light-transmissivemember disposed on a light extraction surface of the light-emittingelement; a cover that covers the light-emitting element with a gapbetween the cover and the light-emitting element, the cover comprising:an upper portion that is transmissive to light emitted from thelight-emitting element, a sidewall extending along a peripheral edge ofthe upper portion and having an outer lateral surface, and a recessdefined by the upper portion and the sidewall; and a fixing memberarranged on at least part of the outer lateral surface of the sidewallof the cover, wherein the fixing member is formed of a material that isdeformable due to a pressing force generated upon engagement with acounterpart member; wherein the fixing member projects from the at leastpart of the outer lateral surface of the sidewall, and wherein thefixing member is partially inserted into the sidewall.
 2. Thelight-emitting device according to claim 1, wherein the cover has aprojected portion on the at least part of the outer lateral surface ofthe sidewall, wherein the fixing member covers the projected portion. 3.The light-emitting device according to claim 1, wherein, in a plan view,the fixing member extends continuously along the outer lateral surfaceof the sidewall in a loop shape.
 4. The light-emitting device accordingto claim 3, wherein the fixing member comprises a plurality ofloop-shaped fixing members arranged side-by side in a height directionof the sidewall.
 5. The light-emitting device according to claim 1,wherein the fixing member is disposed at such a height position relativeto a height of the sidewall that (i) the height position is lower thanan uppermost area extending downward from an upper end of the outerlateral surface of the sidewall by a length of 10% of the height of thesidewall, and (ii) the height position is higher than a lowermost areaextending upward from a lower end of the outer lateral surface of thesidewall by a length of 10% of the height of the sidewall.
 6. Thelight-emitting device according to claim 1, wherein the material of thefixing member is a first resin, and wherein the cover is formed of asecond resin harder than the first resin.
 7. The light-emitting deviceaccording to claim 1, wherein the material of the fixing member is asilicone resin.
 8. The light-emitting device according to claim 1,wherein the upper portion is harder than the fixing member.
 9. Thelight-emitting device according to claim 1, wherein the upper portion ofthe cover comprises a Fresnel lens surface.
 10. An illumination devicecomprising: the light-emitting device according to claim 1, and a casinghaving a through-hole, the casing being the counterpart member, whereinthe light-emitting device is fixed to the casing by the fixing member ofthe light-emitting device being in contact with an inner surface of thethrough-hole of the casing in a state of being deformed.
 11. Alight-emitting device, comprising: a substrate; a light-emitting elementdisposed on the substrate; a light-transmissive member disposed on alight extraction surface of the light-emitting element; a cover thatcovers the light-emitting element with a gap between the cover and thelight-emitting element, the cover comprising: an upper portion that istransmissive to light emitted from the light-emitting element, asidewall extending along a peripheral edge of the upper portion andhaving an outer lateral surface, and a recess defined by the upperportion and the sidewall; and a fixing member arranged on the outerlateral surface of the sidewall of the cover so as to cover an entiretyof the outer lateral surface of the sidewall, wherein the fixing memberis formed of a material that is deformable due to a pressing forcegenerated upon engagement with a counterpart member.
 12. Thelight-emitting device according to claim 11, wherein the cover has aprojected portion on the outer lateral surface of the sidewall, andwherein the fixing member covers the projected portion.
 13. Thelight-emitting device according to claim 11, wherein, in a plan view,the fixing member extends continuously along the outer lateral surfaceof the sidewall in a loop shape.
 14. The light-emitting device accordingto claim 11, wherein the material of the fixing member is a first resin,and wherein the cover is formed of a second resin harder than the firstresin.
 15. The light-emitting device according to claim 11, wherein thematerial of the fixing member is a silicone resin.
 16. Thelight-emitting device according to claim 11, wherein the upper portionis harder than the fixing member.
 17. The light-emitting deviceaccording to claim 11, wherein the upper portion of the cover comprisesa Fresnel lens surface.
 18. An illumination device comprising: thelight-emitting device according to claim 11, and a casing having athrough-hole, the casing being the counterpart member, wherein thelight-emitting device is fixed to the casing by the fixing member of thelight-emitting device being in contact with an inner surface of thethrough-hole of the casing in a state of being deformed.
 19. Alight-emitting device comprising: a substrate; a light-emitting elementdisposed on the substrate; a light-transmissive member disposed on alight extraction surface of the light-emitting element; a cover thatcovers the light-emitting element with a gap between the cover and thelight-emitting element, the cover comprising: an upper portion that istransmissive to light emitted from the light-emitting element, asidewall extending along a peripheral edge of the upper portion andhaving an outer lateral surface, and a recess defined by the upperportion and the sidewall; and a fixing member arranged on at least partof the outer lateral surface of the sidewall of the cover, wherein thefixing member is formed of a material that is deformable due to apressing force generated upon engagement with a counterpart member, andwherein the fixing member is disposed at such a height position relativeto a height of the sidewall that (i) the height position is lower thanan uppermost area extending downward from an upper end of the outerlateral surface of the sidewall by a length of 10% of the height of thesidewall, and (ii) the height position is higher than a lowermost areaextending upward from a lower end of the outer lateral surface of thesidewall by a length of 10% of the height of the sidewall.